Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The new chip, the 12-layer HBM4E, is more than 20% faster than its previous-generation HBM4 products. Samsung said the chip uses its latest 1c DRAM process technology.
The rollout is part of Samsung's efforts to regain momentum in the HBM market after falling behind rivals like SK Hynix and Micron. The move comes just three months after Samsung began shipping its HBM4 chips to customers in February.
Shares of Samsung Electronics rose as much as 6.5% in morning trading. Analysts said the gains reflected Samsung's latest HBM announcement and optimism over the outlook for its AI chip business.
