Huawei expects to design high-end chips by 2031 with transistor density equivalent to 1.4-nanometre processes, despite U.S. sanctions.
The company introduced the Tau Scaling Law at the ISCAS conference in Shanghai.
He Tingbo, Huawei's semiconductor president, presented the new principle focusing on signal transfer time reduction.
If successful, this approach could bypass restrictions on advanced lithography tools.
Huawei's upcoming Kirin chips in fall 2026 will use the LogicFolding architecture.
